a) (a) Illustration of flip-chip bonding between micro-LED array and

Strategy toward the fabrication of ultrahigh-resolution micro-LED displays by bonding-interface-engineered vertical stacking and surface passivation - Nanoscale (RSC Publishing) DOI:10.1039/C9NR04423J

Concept Schematic of (a) the Flip-Chip Structure and (b) Various

DEV-InformationDisplay > ID Archive > 2016 > November/December > FrontlineTechnologyMicro-LED

Three-dimensional monolithic micro-LED display driven by atomically thin transistor matrix

Integration Technology of Micro-LED for Next-Generation Display

Nanomaterials, Free Full-Text

Photonics, Free Full-Text

DEV-InformationDisplay > ID Archive > 2016 > November/December > FrontlineTechnologyMicro-LED

Wafer-scale organic-on-III-V monolithic heterogeneous integration for active-matrix micro-LED displays

Flip Chip Technology

Multi-Metal Layers Unlock a Brighter Future for High-Resolution MicroLED Displays – Display Daily

Figure 1 from CMOS-integrated flip-chip, micro-pixel InGaN LED arrays for on-chip microfluorimetry